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Under the guidance of the China Association for Technology Entrepreneurship, Shanghai Municipal Commission of Economy and Information Technology, Shanghai Association for Science and Technology, Shanghai Hongqiao International Central Business District Management Committee, and Shanghai Minhang District People's Government, this conference is hosted by the National Integrated Circuit Innovation Center, Shanghai Instrument and Meter Industry Association, and Caixin Society. It is organized by Fudan University Optoelectronics Research Institute, Fosun Chip, Science and Technology Innovation Board Daily, Shanghai Nanhongqiao Investment and Development (Group) Co., Ltd., and Shanghai Duanheduan (Hongqiao International Central Business District) Law Firm, and co organized by China Shanghai Testing Center, Shanghai Integrated Circuit Industry Association, and other units. Instrument Information Network, Semiconductor Comprehensive Research Institute, and Shanghai Vacuum Society official website are the supporting media for the conference. Multiple parties work together to provide assistance for the successful holding of the conference. The sentence is:.

Experts and professors in the field of semiconductor testing from Tsinghua University, Peking University, Fudan University, Shanghai Jiao Tong University, East China Normal University, Tongji University, Shanghai University, Shanghai Institute of Technology, Zhejiang University, Nanjing University, Harbin Institute of Technology, Tianjin University, Beihang University, Huazhong University of Science and Technology, Shenzhen University, and Huaqiao University. Chu Junhao, an academician of the CAS Member, president of the Institute of Optoelectronics of Fudan University, Zhuang Songlin, an academician of the CAE Member, president of the School of Optoelectronics Information and Computer Engineering of Shanghai University of Technology, Xu Dongmei, deputy secretary-general of the China Semiconductor Industry Association and secretary-general of the Sealing and Testing Branch, and many other academic and industrial celebrities will be present. In addition, over 100 companies including Zhongke Feice, Shanghai Jingce, Puyuan Jingdian, Northern Huachuang, Tongfu Microelectronics, Suzhou Tianzhun, and Changchuan Technology, along with more than 500 guests, participated in the conference for exchange. At the opening ceremony of the conference, Zhuang Songlin, academician of the CAE Member, Li Kanghong, deputy director of the management committee of Shanghai Hongqiao International CBD, and Shen Xiaoliang, deputy general manager of the National Integrated Circuit Innovation Center addressed the conference.

The following conference report was presided over by Lu Hongliang, professor of the School of Microelectronics of Fudan University and executive chairman of the conference, Shen Lei, deputy general manager of Shanghai Fudan Microelectronics Group Co., Ltd., Xu Dongmei, deputy secretary-general and secretary-general of the Sealing and Testing Branch of the China Semiconductor Industry Association, secretary-general of the Alumni Association of the Microelectronics Industry of Xi'an Jiaotong University, Chu Junhao, president of the Institute of Optoelectronics of Fudan University and academician of the CAS Member, and Tang Wenxin, chairman of Suzhou AlSTech Co., Ltd. former director of the ultra transient device laboratory, and director of scientific research cooperation of the Electronic Microscope Center, successively brought wonderful sharing.

Mr. Tang Wenxin, as the keynote speaker of this keynote speech, highlighted the tremendous driving role of the Super Surface Electron Microscope (USM-E) in China's detection technology and its revolutionary assistance to the world's semiconductor industry and research.

Mr. Tang Wenxin elaborated on the innovative principles of the Super Surface Electron Microscope (USM-E) and its outstanding performance at the nanoscale in his report. He pointed out that USM-E, by adopting advanced technology, can achieve high-resolution imaging and rapid observation of small samples, thus demonstrating unprecedented application potential in fields such as materials science, biomedicine, and nanotechnology.

He further emphasized that the introduction of USM-E will not only significantly enhance China's detection capabilities in the field of microelectronics, but also provide strong technical support for the independent research and development of the domestic semiconductor industry. Mr. Tang Wenxin stated that with China's continuous progress in semiconductor manufacturing and design, USM-E will become a key tool to promote industrial development and help narrow the gap with international advanced levels.

When looking to the future, Mr. Tang Wenxin confidently pointed out that the promotion and application of USM-E will bring revolutionary changes to the global semiconductor industry. He mentioned that with the continuous maturity and optimization of technology, USM-E is expected to play a key role in multiple aspects such as chip manufacturing, defect detection, and material analysis, thereby promoting the upgrading and replacement of the entire industry.

At the end of the report, Mr. Tang Wenxin called on all sectors to strengthen cooperation and jointly promote the further development and application of super surface electron microscope technology. He believes that with the joint efforts of the government, enterprises, and research institutions, China will occupy a more important position in the global semiconductor technology competition and make greater contributions to the world's technological progress.

The report of this conference is detailed and insightful, and has received unanimous praise from experts and scholars from various industries and fields. They all expressed that the report not only analyzed the current industry development trends in depth, but also put forward many forward-looking insights and suggestions, which were refreshing, and expressed a high willingness to cooperate.